945GME Datasheet, PDF (1/2 Pages) Intel Corporation – Mobile Intel® 945GME Express Chipset for Embedded Computing

Product Brief
Mobile Intel® 945GME Express Chipset
Embedded Computing
Mobile Intel® 945GME Express Chipset for
Embedded Computing
Product Overview
The Mobile Intel® 945GME Express chipset provides excellent
flexibility for developers of embedded applications by offering
improved graphics and increased I/O bandwidth over previous
Intel® chipsets, as well as remote asset management capabilities
and improved storage speed and reliability.
Features include an integrated 32-bit 3D graphics engine based
on Intel® Graphics Media Accelerator 950 (Intel® GMA 950) archi-
tecture, a 533/667 MHz front-side bus, 4 GB of 400/533/667
MHz DDR2 SODIMM system memory, Intel® Active Management
Technology¹ (Intel® AMT), and Intel® Matrix Storage Technology.
The Mobile Intel 945GME Express chipset consists of the Intel®
82945GME Graphics Memory Controller Hub (GMCH) and Intel®
I/O Controller Hub 7-M (ICH7-M), available in two SKUs. It delivers
outstanding system performance through high-bandwidth inter-
faces such as PCI Express,*² Serial ATA, and Hi-Speed USB 2.0
connectivity.
The chipset is designed for and validated with Intel® Core™2 Duo
and Intel® Core™ Duo processors, and Intel® Celeron® M processors
on 65nm. Mobile Intel 945GME Express chipset-based platforms
are part of Intel’s comprehensive validation process, enabling fast
deployment of next-generation platforms to help developers maxi-
mize competitive advantage while minimizing development risks.
Product Highlights
• Optimized on a variety of Intel® processors to address the require-
ments of a range of embedded applications such as interactive
clients, gaming platforms and industrial automation equipment:
— Intel Core 2 Duo processors: T7400^Δ at 2.16 GHz with
34 watts thermal design power (TDP), L7400^Δ at
1.5 GHz (17 watts TDP), and U7500^Δ at 1.06 GHz
(10 watts TDP)
— Intel Core Duo processors: T2500^Δ at 2.0 GHz
(31 watts TDP) and L2400^Δ at 1.66 GHz (15 watts TDP)
— Intel Celeron M processor 440^Δ at 1.86 GHz (27 watts TDP)
— Intel Celeron M processor 530^Δ at 1.73 GHz (31 watts TDP)
— Intel Celeron M processor Ultra Low Voltage 423^Δ
(5.5 watts TDP)
• 533/667 MHz front-side bus delivers a high-bandwidth
connection between the processor and platform
• Dual-channel non-ECC 667 MHz DDR2 SODIMM support provides
high-speed system memory for greater platform performance
• Improved graphics with faster performing integrated
graphics engine
• Dual independent display support, at graphics core speeds up
to 250 MHz, provides a wealth of options for using high-
resolution displays
• x16 PCI Express and dual-channel SDVO graphics interfaces
support high throughput for high-end graphics
• Advanced packaging technology and industry-leading electrical
design innovations deliver long-term system reliability over a
broad spectrum of operating conditions
• Direct Media Interface (DMI) chip interconnect can be implemented
at x4 or x2 widths, and provides up to 1 GB/s in each direction in
full duplex
• Four USB host controllers provide high-performance peripherals
with 480 Mb/s of bandwidth, while enabling support for up to
eight USB 2.0 ports
• Up to four PCI Express ports configurable as one single x4 or four
single x1 ports on the ICH7-M (product code NH82801GBM)
• Up to six PCI Express ports configurable as one single x4 and
two x1 ports, or six x1 ports on the ICH7-M DH (Digital Home)
(product code NH82801GHM)
• Intel® High Definition Audio³ interface for full surround sound
• LAN Connect Interface (LCI) provides flexible network solutions
such as 10/100 Mb/s Ethernet and 10/100 Mb/s Ethernet with
LAN manageability
• Integrated Serial ATA host controller supports two ports and
data transfers up to 150 MB/s
• Intel Matrix Storage Technology provides both AHCI and RAID
functionality for improved storage speed and reliability, available
with ICH7-M DH (product code NH82801GHM)