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28F800F3 Datasheet, PDF (1/47 Pages) Intel Corporation – FAST BOOT BLOCK FLASH MEMORY FAMILY 8 AND 16 MBIT
E
PRODUCT PREVIEW
FAST BOOT BLOCK
FLASH MEMORY FAMILY
8 AND 16 MBIT
28F800F3, 28F160F3
Includes Extended and Automotive Temperature Specifications
n High Performance
 54 MHz Effective Zero Wait-State
Performance
 Synchronous Burst-Mode Reads
 Asynchronous Page-Mode Reads
n SmartVoltage Technology
 2.7 V−3.6 V Read and Write
Operations for Low Power Designs
 12 V VPP Fast Factory Programming
n Flexible I/O Voltage
 1.65 V I/O Reduces Overall System
Power Consumption
 5 V-Safe I/O Enables Interfacing to
5 V Devices
n Enhanced Data Protection
 Absolute Write Protection with
VPP = GND
 Block Locking
 Block Erase/Program Lockout
during Power Transitions
n Density Upgrade Path
 8- and 16-Mbit
n Manufactured on ETOX™ V Flash
Technology
n Supports Code Plus Data Storage
 Optimized for Flash Data Integrator
(FDI) Software
 Fast Program Suspend Capability
 Fast Erase Suspend Capability
n Flexible Blocking Architecture
 Eight 4-Kword Blocks for Data
 32-Kword Main Blocks for Code
 Top or Bottom Configurations
Available
n Extended Cycling Capability
 Minimum 10,000 Block Erase Cycles
Guaranteed
n Low Power Consumption
 Automatic Power Savings Mode
Decreases Power Consumption
n Automated Program and Block Erase
Algorithms
 Command User Interface for
Automation
 Status Register for System
Feedback
n Industry-Standard Packaging
 56-Lead SSOP
 µBGA* CSP
Intel’s Fast Boot Block memory family renders high performance asynchronous page-mode and synchronous
burst reads making it an ideal memory solution for burst CPUs. Combining high read performance with the
intrinsic non-volatility of flash memory, this flash memory family eliminates the traditional redundant memory
paradigm of shadowing code from a slow nonvolatile storage source to a faster execution memory for
improved system performance. Therefore, it reduces the total memory requirement which helps increase
reliability and reduce overall system power consumption and cost.
This family of products is manufactured on Intel’s 0.4 µm ETOX™ V process technology. They are available
in industry-standard packages: the µBGA* CSP, ideal for board-constrained applications, and the rugged
56-lead SSOP.
May 1998
Order Number: 290644-001