28F320B3 Datasheet, PDF(1/48 Page) Intel Corporation – SMART 3 ADVANCED BOOT BLOCK 4-, 8-, 16-, 32-MBIT FLASH MEMORY FAMILY

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28F320B3 Datasheet, PDF (1/48 Pages) Intel Corporation – SMART 3 ADVANCED BOOT BLOCK 4-, 8-, 16-, 32-MBIT FLASH MEMORY FAMILY

PRELIMINARY

SMART 3 ADVANCED BOOT BLOCK

4-, 8-, 16-, 32-MBIT

FLASH MEMORY FAMILY

28F400B3, 28F800B3, 28F160B3, 28F320B3

28F008B3, 28F016B3, 28F032B3

n Flexible SmartVoltage Technology

ï£§ 2.7 Vâ3.6 V Read/Program/Erase

ï£§ 12 V VPP Fast Production

Programming

n 2.7 V or 1.65 V I/O Option

ï£§ Reduces Overall System Power

n High Performance

ï£§ 2.7 Vâ3.6 V: 90 ns Max Access Time

ï£§ 3.0 Vâ3.6 V: 80 ns Max Access Time

n Optimized Block Sizes

ï£§ Eight 8-KB Blocks for Data,

Top or Bottom Locations

ï£§ Up to Sixty-Three 64-KB Blocks for

Code

n Block Locking

ï£§ VCC-Level Control through WP#

n Low Power Consumption

ï£§ 10 mA Typical Read Current

n Absolute Hardware-Protection

ï£§ VPP = GND Option

ï£§ VCC Lockout Voltage

n Extended Temperature Operation

ï£§ â40 Â°C to +85 Â°C

n Flash Data Integrator Software

ï£§ Flash Memory Manager

ï£§ System Interrupt Manager

ï£§ Supports Parameter Storage,

Streaming Data (e.g., Voice)

n Automated Program and Block Erase

ï£§ Status Registers

n Extended Cycling Capability

ï£§ Minimum 100,000 Block Erase

Cycles Guaranteed

n Automatic Power Savings Feature

ï£§ Typical ICCS after Bus Inactivity

n Standard Surface Mount Packaging

ï£§ 48-Ball ÂµBGA* Package

ï£§ 48-Lead TSOP Package

ï£§ 40-Lead TSOP Package

n Footprint Upgradeable

ï£§ Upgrade Path for 4-, 8-, 16-, and 32-

Mbit Densities

n ETOXâ¢ VI (0.25 Âµ) Flash Technology

The Smart 3 Advanced Boot Block, manufactured on Intelâs latest 0.25 Âµ technology, represents a feature-

rich solution at overall lower system cost. Smart 3 flash memory devices incorporate low voltage capability

(2.7 V read, program and erase) with high-speed, low-power operation. Several new features have been

added, including the ability to drive the I/O at 1.65 V, which significantly reduces system active power and

interfaces to 1.65 V controllers. A new blocking scheme enables code and data storage within a single

device. Add to this the Intel-developed Flash Data Integrator (FDI) software, and you have a cost-effective,

monolithic code plus data storage solution. Smart 3 Advanced Boot Block products will be available in 40-

lead and 48-lead TSOP and 48-ball ÂµBGA* packages. Additional information on this product family can be

obtained by accessing Intelâs WWW page: http://www.intel.com/design/flash.

July 1998

Order Number: 290580-005

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