28F008B3 Datasheet, PDF (1/49 Pages) Intel Corporation – SMART 3 ADVANCED BOOT BLOCK BYTE-WIDE

E
PRELIMINARY
SMART 3 ADVANCED BOOT BLOCK
BYTE-WIDE
8-MBIT (1024K x 8), 16-MBIT (2056K x 8)
FLASH MEMORY FAMILY
28F008B3, 28F016B3
n Flexible SmartVoltage Technology
 2.7V–3.6V Program/Erase
 2.7V–3.6V Read Operation
 12V VPP Fast Production
Programming
n 2.7V or 1.8V I/O Option
 Reduces Overall System Power
n Optimized Block Sizes
 Eight 8-Kbyte Blocks for Data,
Top or Bottom Locations
 Up to Thirty-One 64-Kbyte Blocks
for Code
n High Performance
 2.7V–3.6V: 120 ns Max Access Time
n Block Locking
 VCC-Level Control through WP#
n Low Power Consumption
 20 mA Maximum Read Current
n Absolute Hardware-Protection
 VPP = GND Option
 VCC Lockout Voltage
n Extended Temperature Operation
 –40°C to +85°C
n Supports Code plus Data Storage
 Optimized for FDI, Flash Data
Integrator Software
 Fast Program Suspend Capability
 Fast Erase Suspend Capability
n Extended Cycling Capability
 10,000 Block Erase Cycles
n Automated Byte Program and Block
Erase
 Command User Interface
 Status Registers
n SRAM-Compatible Write Interface
n Automatic Power Savings Feature
n Reset/Deep Power-Down
 1 µA I_CCTypical
 Spurious Write Lockout
n Standard Surface Mount Packaging
 48-Ball µBGA* Package
 40-Lead TSOP Package
n Footprint Upgradeable
 Upgradeable from 2-, 4- and 8-Mbit
Boot Block
n ETOX™ V (0.4 µ) Flash Technology
n x8-Only Input/Output Architecture
 For Space-Constrained 8-bit
Applications
The new Smart 3 Advanced Boot Block, manufactured on Intel’s latest 0.4µ technology, represents a feature-
rich solution at overall lower system cost. Smart 3 flash memory devices incorporate low voltage capability
(2.7V read, program and erase) with high-speed, low-power operation. Several new features have been
added, including the ability to drive the I/O at 1.8V, which significantly reduces system active power and
interfaces to 1.8V controllers. A new blocking scheme enables code and data storage within a single device.
Add to this the Intel-developed Flash Data Integrator (FDI) software and you have the most cost-effective,
monolithic code plus data storage solution on the market today. Smart 3 Advanced Boot Block Byte-Wide
products will be available in 40-lead TSOP and 48-ball µBGA* packages. Additional information on this
product family can be obtained by accessing Intel’s WWW page: http://www.intel.com/design/flcomp
May 1997
Order Number: 290605-001