IN74LVU04 Datasheet, PDF (6/6 Pages) Integral Corp. – HEX INVERTER

CHIP PAD DIAGRAM IZ74LVU04
IN74LVU04
1.33 ±0.03
13 12 11 10
09
14
08
07
01
02
03 04
05 06
Chip marking
IN74LVU04
(x=0.130; y=0.130)
Pad size 0.108 x 0.108 mm (Pad size is given as per metallization layer)
Thickness of chip 0.46 ± 0,02 mm
Pad No
01
02
03
04
05
06
07
08
09
10
11
12
13
14
Symbol
A1
Y1
A2
Y2
A3
Y3
GND
Y4
A4
Y5
A5
Y6
A6
V_CC
PAD LOCATION
X
0.130
0.130
0.381
0.616
0.881
1.116
1.115
1.115
1.115
0.804
0.569
0.378
0.143
0.130
Y
0.463
0.230
0.126
0.126
0.126
0.126
0.631
0.846
1.181
1.194
1.194
1.194
1.194
0.813
6