V23833-F0005-B101 Datasheet, PDF (9/26 Pages) Infineon Technologies AG – XFP850 nm Small Form Factor Module 10 Gigabit Pluggable Transceiver Compatible with XFP MSA Rev. 3.1

Regulatory Compliance
Feature
Standard
ESD:
Electrostatic Discharge
to the Electrical Pins
(HBM)
EIA/JESD22-A114-B
(MIL-STD 883D
Method 3015.7)
Immunity:
Against Electrostatic
Discharge (ESD) to the
Module Receptacle
EN 61000-4-2
IEC 61000-4-2
Immunity:
Against Radio
Frequency
Electromagnetic Field
EN 61000-4-3
IEC 61000-4-3
Emission:
Electromagnetic
Interference (EMI)
FCC 47 CFR
Part 15, Class B
EN 55022 Class B
CISPR 22
V23833-F0005-B101
V23833-F0005-B102
Description
Comments
Class 1a (> 500 V)
Discharges ranging from ±2 kV to
±25 kV to the front end / faceplate /
receptacle cause no damage to
module (under recommended
conditions).
With a field strength of 30 V/m,
noise frequency ranges from
10 MHz to 2 GHz. No effect on
module performance between the
specification limits.
Noise frequency range:
30 MHz to 40 GHz
Radiated emission does not exceed
specified limits.
Preliminary Product Information
9
2004-06-16