TLD5045EJ_15 Datasheet, PDF (9/30 Pages) Infineon Technologies AG – 700mA High Integration - DC/DC Step-Down Converter

Infineon® LITIX™ Power
TLD5045EJ
General Product Characteristics
4.3
Thermal Resistance
Note: This thermal data was generated in accordance with JEDEC JESD51 standards.
For more information, go to www.jedec.org.
Table 4-3 Thermal Resistance
Parameter
Symbol
Min.
Values
Typ. Max.
Unit Note or
Test Condition
Number
Voltages
Junction to Case
R_thJ-case
10
Junction to Ambient R_thJA
40
(2s2p)
K/W ¹⁾²⁾
K/W ¹⁾³⁾
P_4.3.1
P_4.3.2
1) Not subject to production test, specified by design.
2) Specified R_thJ-case value is simulated at natural convection on a cold plate setup (all pins and the exposed Pad are fixed to
ambient temperature). Ta=25°C, Power Switch and freewheeling diode are dissipating 1W.
3) Specified RthJA value is according to Jedec JESD51-2,-7 at natural convection on FR4 2s2p board; The Product
(Chip+Package) was simulated on a 76.2 x 114.3 x 1.5 mm board with 2 inner copper layers (2 x 70µm Cu, 2 x 35µm Cu).
According to JESD51-5 a thermal via array under the exposed pad contacted the first inner copper layer. Ta=25°C, Power
Switch and freewheeling diode are dissipating 1W.
Data Sheet
9
Revision 1.0
2015-05-28