TLD5085EJ_15 Datasheet, PDF (8/19 Pages) Infineon Technologies AG – 1.8A DC/DC Step-Down Converter

Infineon® LITIX™ Power
TLD5085EJ
General Product Characteristics
4.2
Functional Range
Confidential
Table 4-2 Functional Range
Parameter
Symbol
Values
Min.
Typ. Max.
Supply Voltage
V_S
4.75
45
Output Voltage
V_CC
0.60
16
adjust range
External buck
L_BU
18
56
inductor
External buck
C_BU1
33
120
capacitor
External buck
ESR_BU1
–
0.3
capacitor ESR
Junction
T_j
-40
150
Temperature
1) See section Chapter 8 for loop compensation requirements.
Unit Note or
Test Condition
V
V
see Figure 8-2
Number
P_4.2.1
P_4.2.2
µH see Figure 8-2 and P_4.2.3
Figure 8-3
µF see Figure 8-2 and P_4.2.4
Figure 8-3
Ω
1)
P_4.2.5
°C
P_4.2.6
Note: Within the functional range the IC operates as described in the circuit description. The electrical
characteristics are specified within the conditions given in the related electrical characteristics table.
4.3
Thermal Resistance
Note: This thermal data was generated in accordance with JEDEC JESD51 standards.
For more information, go to www.jedec.org.
Table 4-3 Thermal Resistance
Parameter
Symbol
Values
Unit Note or
Number
Min.
Typ. Max.
Test Condition
Junction to Case
R_thJC
Junction to Ambient R_thJA
(2s2p)
10
42
K/W ¹⁾²⁾
K/W ¹⁾³⁾
P_4.3.1
P_4.3.2
1) Not subject to production test, specified by design.
2) Specified R_thJCe value is simulated at natural convection on a cold plate setup (all pins and the exposed pad are fixed to
ambient temperature). Ta=25°C, Power Switch and freewheeling diode are dissipating 1W.
3) Specified RthJA value is according to Jedec JESD51-2,-7 at natural convection on FR4 2s2p board; The Product
(Chip+Package) was simulated on a 76.2 x 114.3 x 1.5 mm board with 2 inner copper layers (2 x 70µm Cu, 2 x 35µm Cu).
According to JESD51-5 a thermal via array under the exposed pad contacted the first inner copper layer. Ta=25°C, Power
Switch and freewheeling diode are dissipating 1W.
Data Sheet
8
Revision 1.1
2015-03-10