SLE66C681PE Datasheet, PDF (8/8 Pages) Infineon Technologies AG – Security & Chip Card ICs

SLE 66C681PE
Security features:
Since the very beginning, security is an integrated part of Infineons product development, as proved by
various certificates (ITSEC, CC, Proton, VISA, ZKA, Mondex). The so called “integral security concept” for
the 66P series ensures:
• A secret storage of any confidential code, data and keys
• Protection against side channel attacks such as: Simple Power Analysis (SPA) , Differential Power
Analysis (DPA),
• Protection against Differential Fault Analysis (DFA), Electromagnetic Emanation Attack (EMA) and other
possible HW or SW attacks
Peripherals: The CRC module allows the easy generation of checksums according to ISO/IEC 3309 (16-Bit-
CRC). To minimize the overall power consumption, the chip card controller IC offers a sleep mode. The
UART supports the half-duplex transmission protocols T=0 and T=1 according to ISO/IEC 7816-3. All
relevant transmission parameters can be adjusted by software, as e.g. the clock division factor, direct/inverse
convention and the number of stop bits. Additionally, the I/O port can be driven by communication routines
realized in software.
Symmetric algorithms can be processed in software.
The random number generator (RNG) is able to supply the CPU with true random numbers on all conditions.
The advanced sensor concept includes various sensors for any kind of attack scenarios and even more
important a “Life Test ” for sensors.
As an important feature, the chip provides an on-chip security, which fulfills the strong security requirements
of a Common Criteria evaluation at an EAL5+ level.
The SLE 66C681PE fulfills all requirements of today's chip card applications, and is especially designed for
mainstream GSM applications. In addition it offers a powerful platform for multi application cards and
supports the migration to enhanced GSM (incl. WAP), OTA, GPRS and UMTS value added services.
The SLE66C681PE integrates outstanding memory sizes, additional peripherals in combination with
enhanced performance and optimized power consumption on a minimized die size.
Preliminary - Short Product Information 8 / 9
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