XC164S-32F Datasheet, PDF (73/76 Pages) Infineon Technologies AG – 16-Bit Single-Chip Microcontroller with C166SV2 Core

5
Package and Reliability
XC164S-32
Derivatives
Package and Reliability
5.1
Packaging
Table 23 Package Parameters
Parameter
Green Package PG-TQFP-100-5
Thermal resistance junction to case
Thermal resistance junction to leads
Standard Package P-TQFP-100-16
Thermal resistance junction to case
Thermal resistance junction to leads
Symbol Limit Values
Min. Max.
R_ΘJC
–
8
R_ΘJL
–
31
R_ΘJC
–
7
R_ΘJL
–
23
Package Outlines
Unit
K/W
K/W
K/W
K/W
Notes
–
–
–
–
0.5
24 x 0.5 = 12
0.22 ±0.05
C
Seating Plane
0.08 C 100x
Coplanarity
0.08 M A-B D C 100x
H
12˚
0.2 MIN.
0.6 ±0.15
(1)
16
14¹⁾
D
0.2 A-B D 100x
0.2 A-B D H 4x
A
B
100
1
Index Marking
1) Does not include plastic or metal protrusion of 0.25 max. per side
GPP05614
Figure 22 PG-TQFP-100-5 (Plastic Green Thin Quad Flat Package)
Data Sheet
71
V1.0, 2006-08