TDA21231_151 Datasheet, PDF (7/21 Pages) –

TDA21231
4.2
Thermal Characteristics
Table 7
Thermal Characteristics
Parameter
Thermal resistance to case (soldering point)
Thermal resistance to top of package
Thermal resistance to ambient
(P_loss = 4.5 W,T_A = 70 °C, 8 layer server
board with 2 oz copper per layer )
Symbol
θ_JC
θ_JCtop
θ_JA
Min.
–
–
–
–
–
Values
Unit
Typ. Max.
–
2 K/W
–
30
11.5 ^–
8.9
–
8.8
–
Note / Test
Condition
–
–
Still air
200 lfm airflow
300 lfm airflow
4.3
Recommended Operating Conditions and Electrical Characteristics
Note: V_DRV = V_CIN = 5 V, T_A = 25°C
Table 8
Recommended Operating Conditions
Parameter
Symbol
Values
Input voltage
Min. Typ. Max.
V_IN
5
–
16³
MOSFET driver voltage
Logic supply voltage
Frequency of the PWM
Junction temperature
V_PVCC
V_VCC
f_SW
T_jOP
4.5
5
7
4.5
5
7
–
–
1.2
-40
–
125
Unit
V
MHz
°C
Note / Test Condition
For telecom applications see
note 3
3 _{In telecom applications the recommended maximum voltage for VIN is 13.2V unless a boot resistor is used (see Figure 6) to}
limit the voltage spike V_PHASE-V_PGND (AC) to 26V.
Data Sheet
6