BAR89_07 Datasheet, PDF (7/8 Pages) Infineon Technologies AG – Silicon PIN Diode

Package TSLP-2-7
Package Outline
2
1
Top view
0.39
+0.01
-0.03
0.05 MAX.
Bottom view
0.6 ±0.05
2
Cathode
marking
1
0.5 ±0.035 ¹⁾
1) Dimension applies to plated terminal
Foot Print
For board assembly information please refer to Infineon website "Packages"
0.6
0.45
BAR89...
Copper Solder mask
Marking Layout (Example)
Stencil apertures
BAR90-02LRH
Type code
Cathode marking
Laser marking
Standard Packing
Reel ø180 mm = 15.000 Pieces/Reel
Reel ø330 mm = 50.000 Pieces/Reel (optional)
4
0.5
Cathode
marking
0.76
7
2007-04-19