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IKCM20L60GD_16 Datasheet, PDF (6/17 Pages) Infineon Technologies AG – Control Integrated POwer System
Control Integrated POwer System (CIPOS™)
IKCM20L60GD
It is not recommended for proper work to provide
input pulse-width lower than 1µs.
The integrated gate drive provides additionally a
shoot through prevention capability which avoids
the simultaneous on-state of two gate drivers of the
same leg (i.e. HO1 and LO1, HO2 and LO2, HO3 and
LO3). When two inputs of a same leg are activated,
only former activated one is activated so that the
leg is kept steadily in a safe state.
A minimum deadtime insertion of typically 380ns is
also provided by driver IC, in order to reduce cross-
conduction of the external power switches.
VFO (Fault-output and NTC, Pin 14)
The VFO pin indicates a module failure in case of
under voltage at pin VDD or in case of triggered
over current detection at ITRIP. A pull-up resistor is
externally required.
VDD
CIPOSTM
VFO
RON,FLT
From ITRIP - Latch
1
VSS
Thermistor
From UV detection
Figure 5 Internal circuit at pin VFO
The same pin provides direct access to the NTC,
which is referenced to VSS. An external pull-up
resistor connected to +5V ensures that the resulting
voltage can be directly connected to the
microcontroller.
ITRIP (Over current detection function, Pin 15)
CIPOS™ provides an over current detection
function by connecting the ITRIP input with the
IGBT collector current feedback. The ITRIP
comparator threshold (typ. 0.47V) is referenced to
VSS ground. An input noise filter (typ.: tITRIPMIN =
530ns) prevents the driver to detect false over-
current events.
Over current detection generates a shutdown of all
outputs of the gate driver after the shutdown
propagation delay of typically 1000ns.
The fault-clear time is set to minimum 40µs.
VDD, VSS (Low side control supply and reference,
Pin 13, 16)
VDD is the control supply and it provides power
both to input logic and to output power stage.
Input logic is referenced to VSS ground.
The under-voltage circuit enables the device to
operate at power on when a supply voltage of at
least a typical voltage of VDDUV+ = 12.1V is present.
The IC shuts down all the gate drivers power
outputs, when the VDD supply voltage is below
VDDUV- = 10.4V. This prevents the external power
switches from critically low gate voltage levels
during on-state and therefore from excessive power
dissipation.
VB(U, V, W) and VS(U, V, W) (High side supplies, Pin
1 - 6)
VB to VS is the high side supply voltage. The high
side circuit can float with respect to VSS following
the external high side power device emitter voltage.
Due to the low power consumption, the floating
driver stage is supplied by integrated bootstrap
circuit.
The under-voltage detection operates with a rising
supply threshold of typical VBSUV+ = 12.1V and a
falling threshold of VBSUV- = 10.4V.
VS(U, V, W) provide a high robustness against
negative voltage in respect of VSS of -50V
transiently. This ensures very stable designs even
under rough conditions.
NW, NV, NU (Low side emitter, Pin 17 - 19)
The low side emitters are available for current
measurements of each phase leg. It is
recommended to keep the connection to pin VSS as
short as possible in order to avoid unnecessary
inductive voltage drops.
W, V, U (High side emitter and low side collector,
Pin 20 - 22)
These pins are motor U, V, W input pins.
P (Positive bus input voltage, Pin 23)
The high side IGBTs are connected to the bus
voltage. It is noted that the bus voltage does not
exceed 450V.
Datasheet
6
<Revision 2.3>
<2016-08-01>