BBY52_07 Datasheet, PDF (6/7 Pages) Infineon Technologies AG – Silicon Tuning Diodes

Package TSLP-2-1
Package Outline
Top view
0.4 ^+0.1
0.05 MAX.
Bottom view
0.6 ±0.05
2
1
Cathode
marking
2
1
0.5 ±0.0351)
1) Dimension applies to plated terminal
Foot Print
For board assembly information please refer to Infineon website "Packages"
0.6
0.45
BBY52...
Copper Solder mask
Marking Layout (Example)
Stencil apertures
BAS16-02L
Type code
Cathode marking
Laser marking
Standard Packing
Reel ø180 mm = 15.000 Pieces/Reel
Reel ø330 mm = 50.000 Pieces/Reel (optional)
4
0.5
Cathode
marking
0.76
6
2007-04-20