SLE66CLX640P Datasheet, PDF (5/12 Pages) Infineon Technologies AG – Security & Chip Card ICs

µµ
SLE 66CLX640P
Security Features
Operation state monitoring mechanism
The chip goes in a secure reset state on any
following sensors alarm:
• Low and high voltage sensors
• Internal voltage sensor
• Frequency sensors and filters
• Light sensor
• Glitch sensor
• Temperature sensor
• Life Test Sensor
• Internal power-on reset sensor
• Active Shield with automatic and user
controlled attack detection
Anti Snooping
• HW-countermeasures against SPA/DPA-,
Timing- and DFA-attacks (differential fault
analysis)
Supported Standards
• ISO/IEC 7816
• EMV 2000
• GSM 11.1x
• ETSI TS 102 221
• ISO/IEC 14443
• ISO/IEC 3309
• CCIT v.41
• HDLC X25
Secure chip and firmware design
• Security scrambled & optimized chip
layout against physical chip manipulation
• Memory encryption/decryption module
(MED) for XRAM, ROM and EEPROM
against reverse engineering and power
attacks
• ROM code not visible due to implantation
• Mask dependant ROM code encrypted
during production
• Chip Unique encryption of the XRAM and
EEPROM
• Flexible encryption of part or whole
EEPROM by additional user-defined key
• 16 byte Unique chip identification number
for anti-clone countermeasure & tracking
• 16 bytes security PROM hardware
protected (OTP like)
• Secure start of the operating system
ensured by certified Self Test Software
(STS)
• Certified EEPROM programming routines
(RMS_E)
• True Random Number Generator with
Firmware test function
• High Speed SPA/DPA resistant Triple
DES (DDES) Accelerator and Advanced
Crypto Engine
Short Product Information
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2004-04-27