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IPL65R420E Datasheet, PDF (5/15 Pages) –
650VCoolMOS™E6PowerTransistor
IPL65R420E6
3Thermalcharacteristics
Table3ThermalcharacteristicsThinPAK8x8
Parameter
Symbol
Values
Min. Typ. Max.
Thermal resistance, junction - case RthJC
1.5
Thermal resistance, junction - ambient 1) RthJA
65
45
Soldering temperature, wave- &
reflowsoldering allowed
Tsold
260
Unit Note/TestCondition
°C/W
°C/W
SMD version, device on PCB,
minimal footprint
SMD version, device on PCB, 6cm²
cooling area
°C reflow MSL 3
1) Device on 40mm*40mm*1.5mm one layer epoxy PCB FR4 with 6cm² copper area (thickness 70µm) for drain connection.
PCB is vertical without air stream cooling.
Final Data Sheet
5
Rev.2.1,2014-03-07