IR3829MTRPBF Datasheet, PDF (44/50 Pages) Infineon Technologies AG – 16A Highly Integrated Single-Input Synchronous SupIRBuck® Regulator

IR3829
Layout Considerations
8.3
Stencil Design
• Stencils for PQFN can be used with thicknesses of 0.100-0.250mm (0.004-0.010"). Stencils thinner than
0.100mm are unsuitable because they deposit insufficient solder paste to make good solder joints with the
ground pad; high reductions sometimes create similar problems. Stencils in the range of 0.125mm-0.200mm
(0.005-0.008"), with suitable reductions, give the best results.
• Evaluations have shown that the best overall performance is achieved using the stencil design shown in
following Figure. This design is for a stencil thickness of 0.127mm (0.005"). The reduction should be adjusted
for stencils of other thicknesses.
Figure 8-7 Stencil pad spacing (all dimensions in mm)
Datasheet
44
Rev 3.7 03/24/2016