SLE66CX80PE Datasheet, PDF (4/9 Pages) Infineon Technologies AG – Security & Chip Card ICs

SLE 66CX80PE
Memory Management and Protection Unit
• New
Addressable memory of up to 16 Mbyte
• Separates OS (system mode) and application (user
mode)
• System routines called by interrupts
• OS can restrict access to peripherals in application
mode
• Variable application orientated segments defined
and controlled by OS
• Code execution from XRAM possible
• _New
Enhanced multi-application support by 16
descriptors for system / application mode.
Security Features
• Enhanced sensor concept:
• Low and high voltage sensors
• Frequency sensors and filters
• Light Sensor
• Glitch Sensors
• Temperature Sensor
• Life Test Function for Sensors (UMSLC)
• Bus confusion
• Security reset detection
• Current control oscillator
Memory Security
• _New
Sparkling SFR encryption for DDES and ACE, CRC
module and RNG
• 32 bytes security PROM, hardware protected for
batch-, wafer-, die-individual security data. Unique
chip identification number for each chip
• Additional memory for customer-defined security
FabKey on request
• MED – memory encryption/decryption device for
XRAM, ROM and EEPROM
• Security optimized layout and layout scrambling
• Fast IRAM erase
• Enhanced Error correction unit (ECU)
Testmode
Irreversible Lock - Out of test-mode
Anti Snooping
• Automatic randomization smoothing of power profile
• Effective HW-countermeasures against SEMA/DEMA,
SPA/DPA, DFA and Timing-Attacks
• Non standard dedicated Smart Card CPU – Core
• Active Shield with automatic and user controlled attack
detection
• Hardware countermeasures controlled by True
Random Number Generator
Targeted Certifications
• CC EAL5+
• VISA level 3
• MULTOS
• CAST
Support
• HW-& SW-Tools (Emulator, ROM Monitor, Card
Emulator, Simulator, Softmasking)
• Application notes
Supported Standards
• ISO/IEC 7816
• EMV 2000
• GSM 11.11, 11.12, 11.18
• ETSI TS 102 221
Document References
• Confidential Data Book SLE 66CxxxPE
• Qualification report
• Chip delivery specification for wafer with chip-layout
(die size, orientation,...)
• Module specification containing description of
package, etc.
• Qualification report module
Development Tools Overview
• Short Product Information Software Development Kit
SDK CC
• Short Product Information Card Emulator CE66PE
• Short Product Information ROM Monitor RM66PE
• Short Product Information Emulator ET66PE Hitex or
ET66PE KSC
• Short Product Information Smart Mask Package
Preliminary - Short Product Information 4 / 9
02.04