SLE55R08 Datasheet, PDF (4/8 Pages) Infineon Technologies AG – Security & Chip Card ICs

SLE 55R08
Ordering and Packaging information
Table 1 Ordering Information
Type
Package¹⁾
SLE 55R08C
SLE 55R08LM
Die
MCC2-2-1
Memory
User
Admin.
1024 bytes 256 bytes
1024 bytes 256 bytes
Pages Ordering Code
128 on request
128 on request
Pin Description
Figure 1 Pin Configuration Module Contactless Card (top view)
LA
SLE 55R08
LB
Figure 2 Pad Configuration Die
Table 2
Symbol
LA
LB
Pin Definitions and Functions
Function
Antenna connection
Antenna connection
1) _{Available as a Module Contactless Card (MCC) for embedding in plastic cards or as a die (C) for customer packaging}
Short Product Information
4/8
2001-01-31