TLE7234EM Datasheet, PDF (33/36 Pages) Infineon Technologies AG – SPI Driver for Enhanced Relay Control

10
Package Outlines
SPI Driver for Enhanced Relay Control
TLE7234EM
Package Outlines
0.35 x 45˚
2x
0.1 C D
3.9 ^±0.11)
0.25 ^{±0.05 2)}
0.65 ^C
0.08 C
Seating Plane
0.2 ^M C A-B D 24x
0.64 _±0.25
6 ^±0.2
D
0.2 ^M D
A
24
13
Bottom View
1
12
1
12
B
8.65 ^±0.1
Index Marking
0.1 C A-B 2x
24
13
6.4 ^±0.25
1) Does not include plastic or metal protrusion of 0.15 max. per side
2) Does not include dambar protrusion of 0.13 max.
Figure 13 PG-SSOP-24-4 (Plastic Green Slim Small Outline Package)
PG-SSOP-24-4-PO V01
Green Product (RoHS compliant)
To meet the world-wide customer requirements for environmentally friendly products and to be compliant with
government regulations the device is available as a green product. Green products are RoHS-Compliant (i.e Pb-
free finish on leads and suitable for Pb-free soldering according to IPC/JEDEC J-STD-020).
For further information on alternative packages, please visit our website:
http://www.infineon.com/packages.
Data Sheet
34
Dimensions in mm
Rev. 1.0, 2010-02-18