SLE22C05S Datasheet, PDF (3/7 Pages) Infineon Technologies AG – Security & Chip Card ICs

16-bit Security Controller with
8-Kbytes ROM, 128 Bytes RAM and
512-Bytes EEPROM
Features
• 16-bit microcomputer in 0.6 µm CMOS
technology
• Instruction set opcode compatible with
standard SAB 8051 processor
• Enhanced 16-bit arithmetic
• Additional powerful instructions optimized
for chip card applications
• Dedicated, non-standard architecture with
execution time six times faster than
standard SAB 8051 processor
• 7.5-Kbytes User ROM for application
programs
• 512-bytes reserved ROM for Resource
Management System (RMS) with intelligent
write/erase routines
• 512-Bytes EEPROM as program/data
memory
• 128 bytes RAM
• CRC Module
• Power saving sleep mode
• Clock freq. = int. freq.: 1 to 7.5 MHz
• Contact configuration and serial interface in
accordance with ISO 7816
• Supply voltage range: 2.7 V to 5.5 V
• Current consumption < 8 mA at 5 MHz and
5.5 V
• Temperature range: -25 to +70°C
• ESD protection larger than 4 kV
Testmode
• Irreversible Lock - Out of testmode
Anti Snooping
• HW-countermeasures against SPA/DPA-,
Timing- and DFA-attacks (differential fault
analysis-DFA)
• CRC - Module
• Non standard dedicated Smart Card CPU
– Core
SLE 22C05S
EEPROM
• Reading, erasing and writing byte by byte
• Flexible page mode for 1 to 8 bytes
write/erase operation
• 24 bytes security area
• Write time 3.62 ms, erase time 1.81 ms
• Minimum of 500,000 write/erase cycles
• Data retention for a minimum of ten years
• EEPROM programming voltage
generated on chip
Security Features
Operation state monitoring mechanism
• Low and high voltage sensors
• Frequency sensors and filters
Memory Security
• 8 bytes security PROM, hardware protected
• Unique chip identification number for each
chip
• MED – memory encryption/decryption device
for XRAM, ROM and EEPROM
• Security optimised layout and layout
scrambling
• Mask specific encryption key for EEPROM
• Move code blocking (from EEPROM)
Document References
• Confidential Data Book SLE 22CxxS
• Confidential Instruction SET SLE 66CxxS
• Confidential Quick Reference SLE 66CxxS
• Qualification report
• Chip delivery specification for wafer with
chip-layout (die size, orientation,...)
• Module specification containing description
of package, etc.
• Qualification report module
Short Product Information
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