IPD04N03L Datasheet, PDF (2/8 Pages) Infineon Technologies AG – OptiMOS Buck converter series

Thermal Characteristics
Parameter
Characteristics
Thermal resistance, junction - case
SMD version, device on PCB:
@ min. footprint
@ 6 cm² cooling area ⁴⁾
IPD04N03L
Symbol
Values
Unit
min. typ. max.
R_thJC
R_thJA
-
0.7
1 K/W
-
-
75
-
-
50
Electrical Characteristics, at T_j = 25 °C, unless otherwise specified
Parameter
Symbol
Values
Unit
min. typ. max.
Static Characteristics
Drain-source breakdown voltage
V_GS=0V, I_D=1mA
Gate threshold voltage, V_GS = V_DS
I_D=100µA
Zero gate voltage drain current
V_DS=30V, V_GS=0V, T_j=25°C
V_DS=30V, V_GS=0V, T_j=125°C
Gate-source leakage current
V_GS=20V, V_DS=0V
Drain-source on-state resistance
V_GS=4.5, I_D=50A
Drain-source on-state resistance
V_GS=10V, I_D=50A
V_(BR)DSS 30
-
-V
V_GS(th)
1.2 1.6
2
I _DSS
I _GSS
µA
- 0.01 1
-
10 100
-
1 100 nA
R_DS(on)
-
5
6.3 mΩ
R_DS(on)
-
3.4 4.2
1pin _{1 and 2 have to be connected together on the PCB as well as pin 4 and 5.}
2Current _{limited by bondwire ; with an RthJC = 1K/W the chip is able to carry ID= 145A at 25°C, for detailed}
information see app.-note ANPS071E available at www.infineon.com/optimos
3Defined _{by design. Not subject to production test.}
4Device _{on 40mm*40mm*1.5mm epoxy PCB FR4 with 6cm² (one layer, 70 µm thick) copper area for drain}
connection. PCB is vertical without blown air.
Page 2
2003-01-17