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BAS40_11 Datasheet, PDF (2/3 Pages) Infineon Technologies AG – HiRel Silicon Schottky Diode | |||
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Maximum Ratings
Parameter
Reverse Voltage
Forward Current
Surge Forward Current 1)
Power Dissipation 2)
Operating Temperature Range
Storage Temperature Range
Soldering Temperature 3)
Junction Temperature
Thermal Resistance Junction-Case
Symbol
VR
IF
IFSM
Ptot
Top
Tstg
Tsol
Tj
Rth(j-c)
Values
40
120
170
250
-55 to +150
-55 to +150
+250
150
100
BAS40
Unit
V
mA
mA
mW
°C
°C
°C
°C
K/W
Electrical Characteristics
at TA=25°C; unless otherwise specified
Parameter
Symbol
Values
Unit
min. typ.
max.
DC Characteristics
Reverse Current 1, VR=40V
Reverse Current 2, VR=30V
Forward Voltage 1, IF1=1mA
Forward Voltage 2, IF2=10mA
Forward Voltage 3, IF3=40mA
Differential Forward Resistance 4)
IF=10mA, IF=15mA
IR1
-
-
10 µA
IR2
-
-
1
µA
VF1
0,29 0,33
0,39 V
VF2
0,42 0,45
0,54 V
VF3
0,68 0,7
0,85 V
RFD
7,5
10
11,5 ï
AC Characteristics
Total Capacitance
CT
2,2 2,9
5,0 pF
VR=0V; f=1MHz
Notes.:
1.) t ï£ 10ms, Duty Cycle=10%
2.) At TCASE = 125 °C. For TCASE > 125 °C derating is required.
3.) During 5 sec. maximum. The same terminal shall not be resoldered until 3 minutes have elapsed.
ïVF
4.)
RFD=----------------
5x10-3 A
IFAG IMM RPD D HIR
2 of 3
V2, February 2011
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