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AUIRFR5505 Datasheet, PDF (2/11 Pages) International Rectifier – HEXFET® Power MOSFET | |||
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AUIRFR/U5505
Static @ TJ = 25°C (unless otherwise specified)
Parameter
Min. Typ. Max. Units
Conditions
V(BR)DSS
ïV(BR)DSS/ïTJ
RDS(on)
VGS(th)
gfs
IDSS
IGSS
Drain-to-Source Breakdown Voltage
Breakdown Voltage Temp. Coefficient
Static Drain-to-Source On-Resistance
Gate Threshold Voltage
Forward Trans conductance
Drain-to-Source Leakage Current
Gate-to-Source Forward Leakage
Gate-to-Source Reverse Leakage
-55 âââ âââ V VGS = 0V, ID = -250µA
âââ -0.049 âââ V/°C Reference to 25°C, ID = -1mA
âââ âââ 0.11 ïï ï VGS = -10V, ID = -9.6A ï
-2.0 âââ -4.0 V VDS = VGS, ID = -250µA
4.2 âââ âââ S VDS = -25V, ID = -9.6A ï
âââ
âââ
âââ -25
âââ -250
µA
VDS = -55 V, VGS = 0V
VDS = -44V,VGS = 0V,TJ =150°C
âââ
âââ
âââ -100
âââ 100
nA
VGS = -20V
VGS = 20V
Dynamic Electrical Characteristics @ TJ = 25°C (unless otherwise specified)
Qg
Total Gate Charge
Qgs
Gate-to-Source Charge
Qgd
Gate-to-Drain Charge
td(on)
Turn-On Delay Time
tr
Rise Time
td(off)
Turn-Off Delay Time
tf
Fall Time
LD
Internal Drain Inductance
LS
Internal Source Inductance
Ciss
Input Capacitance
Coss
Output Capacitance
Crss
Reverse Transfer Capacitance
Diode Characteristics
âââ âââ 32
ID = -9.6A
âââ âââ 7.1 nC VDS = -44V
âââ âââ 15
VGS = -10V, See Fig 6 and 13 ï
âââ 12 âââ
VDD = -28V
âââ
âââ
28
20
âââ
âââ
ns
ID = -9.6A
RG = 2.6ïï
âââ 16 âââ
RD = 2.8ïï¬ï See Fig 10 ï
âââ
âââ
4.5
7.5
âââ
âââ
Between lead,
nH
6mm (0.25in.)
from package
ï
and center of die contact
âââ 650 âââ
VGS = 0V
âââ 270 âââ pF VDS = -25V
âââ 120 âââ
Æ = 1.0MHz, See Fig. 5
Parameter
IS
Continuous Source Current
(Body Diode)
ISM
Pulsed Source Current
(Body Diode)ï ïï
VSD
Diode Forward Voltage
trr
Reverse Recovery Time
Qrr
Reverse Recovery Charge
ton
Forward Turn-On Time
Min.
âââ
âââ
âââ
âââ
âââ
Typ.
âââ
âââ
âââ
51
110
Max. Units
Conditions
-18
-64
MOSFET symbol
A
showing the
integral reverse
p-n junction diode.
-1.6 V TJ = 25°C,IS = -9.6A,VGS = 0V ïï
77 ns TJ = 25°C ,IF = -9.6A
160 nC di/dt = 100A/µs ïï
Intrinsic turn-on time is negligible (turn-on is dominated by LS+LD)
Notes:ï
ï Repetitive rating; pulse width limited by max. junction temperature. (See fig. 11)
ï VDD = -25V, starting TJ = 25°C, L = 2.8mH, RG = 25ï, IAS = -6.6A. (See Fig.12)
ï ISD ï£ï -6.6A, di/dt ï£ï -240A/µs, VDD ï£ï V(BR)DSS, TJ ï£ 150°C.
ï Pulse width ï£ï 300µs; duty cycle ï£ 2%.
ï
ï This is applied for I-PAK, LS of D-PAK is measured between lead and center of die contact .ï
ïï Uses IRF9Z24N data and test conditions.ï
ï When mounted on 1" square PCB (FR-4 or G-10 Material). For recommended footprint and soldering techniques refer to
application note #AN-994
2
2015-10-12
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