English
Language : 

AUIRFR5505 Datasheet, PDF (2/11 Pages) International Rectifier – HEXFET® Power MOSFET
AUIRFR/U5505
Static @ TJ = 25°C (unless otherwise specified)
Parameter
Min. Typ. Max. Units
Conditions
V(BR)DSS
V(BR)DSS/TJ
RDS(on)
VGS(th)
gfs
IDSS
IGSS
Drain-to-Source Breakdown Voltage
Breakdown Voltage Temp. Coefficient
Static Drain-to-Source On-Resistance
Gate Threshold Voltage
Forward Trans conductance
Drain-to-Source Leakage Current
Gate-to-Source Forward Leakage
Gate-to-Source Reverse Leakage
-55 ––– ––– V VGS = 0V, ID = -250µA
––– -0.049 ––– V/°C Reference to 25°C, ID = -1mA
––– ––– 0.11  VGS = -10V, ID = -9.6A 
-2.0 ––– -4.0 V VDS = VGS, ID = -250µA
4.2 ––– ––– S VDS = -25V, ID = -9.6A 
–––
–––
––– -25
––– -250
µA
VDS = -55 V, VGS = 0V
VDS = -44V,VGS = 0V,TJ =150°C
–––
–––
––– -100
––– 100
nA
VGS = -20V
VGS = 20V
Dynamic Electrical Characteristics @ TJ = 25°C (unless otherwise specified)
Qg
Total Gate Charge
Qgs
Gate-to-Source Charge
Qgd
Gate-to-Drain Charge
td(on)
Turn-On Delay Time
tr
Rise Time
td(off)
Turn-Off Delay Time
tf
Fall Time
LD
Internal Drain Inductance
LS
Internal Source Inductance
Ciss
Input Capacitance
Coss
Output Capacitance
Crss
Reverse Transfer Capacitance
Diode Characteristics
––– ––– 32
ID = -9.6A
––– ––– 7.1 nC VDS = -44V
––– ––– 15
VGS = -10V, See Fig 6 and 13 
––– 12 –––
VDD = -28V
–––
–––
28
20
–––
–––
ns
ID = -9.6A
RG = 2.6
––– 16 –––
RD = 2.8See Fig 10 
–––
–––
4.5
7.5
–––
–––
Between lead,
nH
6mm (0.25in.)
from package

and center of die contact
––– 650 –––
VGS = 0V
––– 270 ––– pF VDS = -25V
––– 120 –––
ƒ = 1.0MHz, See Fig. 5
Parameter
IS
Continuous Source Current
(Body Diode)
ISM
Pulsed Source Current
(Body Diode)
VSD
Diode Forward Voltage
trr
Reverse Recovery Time
Qrr
Reverse Recovery Charge
ton
Forward Turn-On Time
Min.
–––
–––
–––
–––
–––
Typ.
–––
–––
–––
51
110
Max. Units
Conditions
-18
-64
MOSFET symbol
A
showing the
integral reverse
p-n junction diode.
-1.6 V TJ = 25°C,IS = -9.6A,VGS = 0V 
77 ns TJ = 25°C ,IF = -9.6A
160 nC di/dt = 100A/µs 
Intrinsic turn-on time is negligible (turn-on is dominated by LS+LD)
Notes:
 Repetitive rating; pulse width limited by max. junction temperature. (See fig. 11)
 VDD = -25V, starting TJ = 25°C, L = 2.8mH, RG = 25, IAS = -6.6A. (See Fig.12)
 ISD -6.6A, di/dt -240A/µs, VDD V(BR)DSS, TJ  150°C.
 Pulse width 300µs; duty cycle  2%.
This is applied for I-PAK, LS of D-PAK is measured between lead and center of die contact .
Uses IRF9Z24N data and test conditions.
 When mounted on 1" square PCB (FR-4 or G-10 Material). For recommended footprint and soldering techniques refer to
application note #AN-994
2
2015-10-12