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| 6ED003L06-F2 Datasheet, PDF (19/20 Pages) Infineon Technologies AG – Signal interlocking of every phase to prevent cross-conduction | |||
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6.2
PG-TSSOP-28
EiceDRIVERâ¢
6ED003L06-F2, 6ED003L02-F2
Footprint for Reflow soldering
e = 0.65
A = 6.10
L = 1.30
B = 0.40
Figure 17 Package drawing
Figure 18 PCB reference layout (according to JEDEC 1s0P)
left: Reference layout
right: detail of footprint
Table 8
Data of reference layout
Dimensions
Material
76.2 ï´ 114.3 ï´ 1.5 mm³
FR4 (ï¬therm = 0.3 W/mK)
Metal (Copper)
70µm (ï¬therm = 388 W/mK)
datasheet
19
<Revision 2.7>, 15.04.2015
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