V23814-Z6-Z1 Datasheet, PDF (1/3 Pages) Infineon Technologies AG – Heatsink for PAROLI Backplane Module

Heatsink for PAROLI^® Backplane Module
Fiber Optics
V23814-Z6-Z1
1
General Scope
This data sheet describes the detachable heatsink for PAROLI^® Backplane module
V23814-x1306-M133¹⁾ (transmitter) resp. V23815-x1306-M133¹⁾ (receiver).
2
Technical Data
See Figure 1.
Dimensions
Material
Coefficient of thermal conduction
No. of fins
45 x 24 x 8.75±0.2 mm (L x W x H)
Al Mg 4.5 Mn, black anodized
110…140 W m^–1 K^–1
14 (1.4 mm width)
3
Application and Assembly
Application is the use of the heatsink to attach onto the module baseplate.
For optimized heat transfer between module and heatsink Infineon recommends to use
a heat dissipation foil between both parts (e.g. Panasonic PGS 0.1 mm thickness).
Dimensions see Figure 2.
The fixing is done by two screws.
Recommendation for screw dimensions: ISO 7045 - M1.6 x 6 - A2 50 - H.
The screws have to be fixed with 10 Ncm.
1) _{x = K for 1.25 Gbit/s}
x = U for 1.6 Gbit/s
x = Q for 2.7 Gbit/s
PAROLI^® is a registered trademark of Infineon Technologies
Data Sheet
1
2003-07-25