TDA5211_15 Datasheet, PDF (1/1 Pages) Infineon Technologies AG – Material Content Data Sheet

Material Content Data Sheet
Sales Product Name TDA5211
MA#
MA000223761
Package
PG-TSSOP-28-1
Construction Element Material Group
Substances
chip
leadframe
wire
encapsulation
leadfinish
plating
glue
*deviation
inorganic material
non noble metal
non noble metal
noble metal
organic material
plastics
inorganic material
non noble metal
noble metal
plastics
noble metal
< 10%
silicon
nickel
iron
gold
carbon black
epoxy resin
silicondioxide
tin
silver
acrylic resin
silver
Issued
7. September 2015
CAS#
if applicable
7440-21-3
7440-02-0
7439-89-6
7440-57-5
1333-86-4
-
60676-86-0
7440-31-5
7440-22-4
-
7440-22-4
Weight*
107.00 mg
Weight
[mg]
Average
Mass
[%]
Sum
[%]
Average
Mass
[ppm]
Sum
[ppm]
2.457
2.30
2.30 22966 22966
14.398 13.46
134561
19.882 18.58 32.04 185822 320383
0.938
0.88
0.88
8768
8768
0.196
0.18
1833
8.301
7.76
77585
56.867 53.15 61.09 531486 610904
1.559
1.46
1.46 14568 14568
1.416
1.32
1.32 13231 13231
0.196
0.18
1836
0.786
0.73
0.91
7344
9180
Sum in total: 100.00
1000000
Important Remarks:
1. Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
2. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
3. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
This product is in compliance with EU Directive 2011/65/EU (RoHS) and does not use any exemption.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com