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SIGC25T120CS2 Datasheet, PDF (1/4 Pages) Infineon Technologies AG – IGBT Chip in NPT-technology | |||
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IGBT Chip in NPT-technology
SIGC25T120CS2
FEATURES:
⢠1200V NPT technology 175µm chip
⢠low turn-off losses
⢠short tail current
⢠positive temperature coefficient
⢠easy paralleling
This chip is used for:
⢠IGBT Modules
Applications:
⢠drives, SMPS, resonant
applications
C
G
E
Chip Type
VCE
ICn
Die Size
Package Ordering Code
SIGC25T120CS2 1200V 15A 5.71 x 4.53 mm2 sawn on foil Q67050-A4197
MECHANICAL PARAMETER:
Raster size
Emitter pad size
Gate pad size
Area total / active
Thickness
Wafer size
Flat position
Max.possible chips per wafer
Passivation frontside
Emitter metallization
Collector metallization
Die bond
Wire bond
Reject Ink Dot Size
Recommended Storage Environment
5.71 x 4.53
mm2
2x (2.18 x 1.6)
1.09 x 0.68
25.9 / 18.7
180
µm
150
mm
270
grd
555 pcs
Photoimide
3200 nm Al Si 1%
1400 nm Ni Ag âsystem
suitable for epoxy and soft solder die bonding
electrically conductive glue or solder
Al, <500µm
â
0.65mm ; max 1.2mm
store in original container, in dry nitrogen,
< 6 month at an ambient temperature of 23°C
Edited by INFINEON Technologies AI PS DD HV3, L 7141-T, Edition 2, 03.09.2003
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