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SIGC20T120 Datasheet, PDF (1/4 Pages) Infineon Technologies AG – IGBT3 Chip | |||
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IGBT3 Chip
SIGC20T120
FEATURES:
⢠1200V Trench + Field Stop technology
⢠low turn-off losses
⢠short tail current
⢠positive temperature coefficient
⢠easy paralleling
This chip is used for:
⢠power module
Applications:
⢠drives
C
G
E
Chip Type
SIGC20T120
VCE
ICn
Die Size
1200V 15A 4.41 x 4.47 mm2
Package Ordering Code
sawn on foil
Q67050-
A4103-A001
MECHANICAL PARAMETER:
Raster size
Emitter pad size
Gate pad size
Area total / active
Thickness
Wafer size
Flat position
Max.possible chips per wafer
Passivation frontside
Emitter metallization
Collector metallization
Die bond
Wire bond
Reject Ink Dot Size
Recommended Storage Environment
4.41 x 4.47
mm
2.995 x 2.901
1.107 x 0.702
19.7 / 12.8
mm2
140
µm
150
mm
0
grd
748 pcs
Photoimide
3200 nm AlSiCu
1400 nm Ni Ag âsystem
suitable for epoxy and soft solder die bonding
electrically conductive glue or solder
Al, <500µm
â
0.65mm ; max 1.2mm
store in original container, in dry nitrogen,
< 6 month at an ambient temperature of 23°C
Edited by INFINEON Technologies AI PS DD HV3, L7631A, Edition 2, 04.09.2003
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