SIDC30D60E6 Datasheet, PDF (1/4 Pages) Infineon Technologies AG – Fast switching diode chip in EMCON-Technology

Preliminary
SIDC30D60E6
Fast switching diode chip in EMCON-Technology
FEATURES:
• 600V EMCON technology 70 µm chip
• soft , fast switching
This chip is used for:
• EUPEC power modules and
discrete devices
A
• low reverse recovery charge
• small temperature coefficient
Applications:
C
• SMPS, resonant applications,
drives
Chip Type
SIDC30D60E6
V_R
I_F
Die Size
600V 75A
5.5 x 5.5 mm²
Package Ordering Code
sawn on foil
C67047-A4679-
A001
MECHANICAL PARAMETER:
Raster size
Area total / active
Anode pad size
Thickness
Wafer size
Flat position
Max. possible chips per wafer
Passivation frontside
Anode metallisation
Cathode metallisation
Die bond
Wire bond
Reject Ink Dot Size
Recommended Storage Environment
5.5 x 5.5
30.25 / 23.33
mm²
4.78 x 4.78
70
µm
150
mm
180
deg
482 pcs
Photoimide
3200 nm AlSiCu
1400 nm Ni Ag –system
suitable for epoxy and soft solder die bonding
electrically conductive glue or solder
Al, ≤500µm
∅ 0.65mm ; max 1.2mm
store in original container, in dry nitrogen,
< 6 month at an ambient temperature of 23°C
Edited by INFINEON Technologies AI PS DD HV3, L 4183M, Edition 1, 8.01.2002