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| SIDC20D60C6 Datasheet, PDF (1/4 Pages) Infineon Technologies AG – Fast switching diode chip in EMCON 3 -Technology | |||
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SIDC20D60C6
Fast switching diode chip in EMCON 3 -Technology
FEATURES:
⢠600V EMCON 3 technology 70 µm chip
⢠soft, fast switching
⢠low reverse recovery charge
This chip is used for:
⢠power module
⢠discrete components
A
⢠small temperature coefficient
Applications:
C
⢠drives
Chip Type
SIDC20D60C6
VR
IF
600V 75A
Die Size
5.37 x 3.75 mm2
Package
sawn on foil
MECHANICAL PARAMETER:
Raster size
Area total / active
Anode pad size
Thickness
Wafer size
Flat position
Max. possible chips per wafer
Passivation frontside
Anode metallization
Cathode metallization
Die bond
Wire bond
Reject ink dot size
Recommended storage environment
5.37 x 3.75
20.14 / 16.66
mm2
4.67 x 3.05
70
µm
150
mm
180
deg
701 pcs
Photoimide
3200 nm AlSiCu
Ni Ag âsystem
suitable for epoxy and soft solder die bonding
electrically conductive glue or solder
Al, â¤500µm
â
0.65mm; max 1.2mm
store in original container, in dry nitrogen,
< 6 month at an ambient temperature of 23°C
Edited by INFINEON Technologies, AIM PMD D CID CLS, L4571M, Edition 1.1, 10.07.2006
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