MA001406974 Datasheet, PDF (1/1 Pages) Infineon Technologies AG – Material Content Data Sheet

Material Content Data Sheet
Sales Product Name XMC1302-T038X0200 AA
MA#
MA001406974
Package
PG-TSSOP-38-9
Construction Element Material Group
Substances
chip
leadframe
wire
encapsulation
leadfinish
plating
glue
*deviation
inorganic material
inorganic material
non noble metal
non noble metal
non noble metal
noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
noble metal
plastics
noble metal
< 10%
silicon
phosphorus
zinc
iron
copper
palladium
copper
carbon black
epoxy resin
silicondioxide
tin
silver
epoxy resin
silver
Issued
14. September 2015
CAS#
if applicable
7440-21-3
7723-14-0
7440-66-6
7439-89-6
7440-50-8
7440-05-3
7440-50-8
1333-86-4
-
60676-86-0
7440-31-5
7440-22-4
-
7440-22-4
Weight*
118.36 mg
Weight
[mg]
Average
Mass
[%]
Sum
[%]
Average
Mass
[ppm]
Sum
[ppm]
1.097
0.93
0.93
9272
9272
0.015
0.01
127
0.060
0.05
506
1.199
1.01
10129
48.679 41.13 42.20 411298 422060
0.003
0.00
26
0.308
0.26
0.26
2599
2625
0.192
0.16
1623
7.494
6.33
63314
56.362 47.63 54.12 476206 541143
2.200
1.86
1.86 18586 18586
0.337
0.28
0.28
2850
2850
0.102
0.09
866
0.307
0.26
0.35
2598
3464
Sum in total: 100.00
1000000
Important Remarks:
1. Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
2. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
3. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
This product is in compliance with EU Directive 2011/65/EU (RoHS) and does not use any exemption.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com