MA001384120 Datasheet, PDF (1/1 Pages) Infineon Technologies AG – Material Content Data Sheet

Material Content Data Sheet
Sales Product Name IPD50N10S3L-16
MA#
MA001384120
Package
PG-TO252-3-11
Construction Element Material Group
Substances
chip
leadframe
wire
encapsulation
leadfinish
plating
solder
heatspreader
*deviation
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
non noble metal
inorganic material
noble metal
non noble metal
non noble metal
non noble metal
inorganic material
non noble metal
< 10%
silicon
iron
phosphorus
copper
aluminium
carbon black
epoxy resin
silicondioxide
tin
nickel
phosphorus
silver
tin
lead
iron
phosphorus
copper
Issued
21. September 2015
CAS#
if applicable
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
60676-86-0
7440-31-5
7440-02-0
7723-14-0
7440-22-4
7440-31-5
7439-92-1
7439-89-6
7723-14-0
7440-50-8
Weight*
372.55 mg
Weight
[mg]
Average
Mass
[%]
Sum
[%]
Average
Mass
[ppm]
Sum
[ppm]
4.497
1.21
1.21 12071 12071
0.215
0.06
578
0.065
0.02
173
215.017 57.70 57.78 577143 577894
3.859
1.04
1.04 10358 10358
1.218
0.33
3270
21.319
5.72
57225
99.287 26.65 32.70 266504 326999
3.787
1.02
1.02 10164 10164
0.091
0.02
244
0.000
0.00
0.02
1
245
0.100
0.03
268
0.080
0.02
215
3.816
1.02
1.07 10243 10726
0.019
0.01
52
0.006
0.00
15
19.177
5.15
5.16 51476 51543
Sum in total: 100.00
1000000
Important Remarks:
1. Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
2. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
3. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
This product is in compliance with EU Directive 2011/65/EU (RoHS) and contains Pb according RoHS exemption
7a, Lead in high melting temperature type solders.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com