MA001338290 Datasheet, PDF (1/1 Pages) Infineon Technologies AG – Material Content Data Sheet

Material Content Data Sheet
Sales Product Name BSC159N10LSF G
MA#
MA001338290
Package
PG-TDSON-8-1
Construction Element Material Group
Substances
chip
leadframe
wire
encapsulation
leadfinish
plating
solder
CLIP plating
heatspreader
heat sink CLIP
*deviation
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
noble metal
noble metal
non noble metal
non noble metal
noble metal
non noble metal
inorganic material
non noble metal
non noble metal
inorganic material
non noble metal
< 10%
silicon
iron
phosphorus
copper
copper
carbon black
epoxy resin
silicondioxide
tin
silver
silver
tin
lead
silver
iron
phosphorus
copper
iron
phosphorus
copper
Issued
19. February 2015
CAS#
if applicable
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7440-50-8
1333-86-4
-
60676-86-0
7440-31-5
7440-22-4
7440-22-4
7440-31-5
7439-92-1
7440-22-4
7439-89-6
7723-14-0
7440-50-8
7439-89-6
7723-14-0
7440-50-8
Weight*
121.70 mg
Weight
[mg]
Average
Mass
[%]
Sum
[%]
Average
Mass
[ppm]
Sum
[ppm]
3.666
3.01
3.01 30127 30127
0.038
0.03
311
0.011
0.01
93
37.762 31.02 31.06 310297 310701
0.034
0.03
0.03
280
280
0.081
0.07
667
5.763
4.74
47358
34.742 28.55 33.36 285481 333506
1.452
1.19
1.19 11929 11929
0.166
0.14
0.14
1360
1360
0.076
0.06
624
0.061
0.05
499
2.899
2.38
2.49 23825 24948
1.289
1.06
1.06 10596 10596
0.011
0.01
93
0.003
0.00
28
11.320
9.30
9.31 93019 93140
0.022
0.02
183
0.007
0.01
55
22.292 18.32 18.35 183175 183413
Sum in total: 100.00
1000000
Important Remarks:
1. Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
2. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
3. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
This product is in compliance with EU Directive 2011/65/EU (RoHS) and contains Pb according RoHS exemption
7a, Lead in high melting temperature type solders.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com