MA001326358 Datasheet, PDF (1/1 Pages) Infineon Technologies AG – Material Content Data Sheet

Material Content Data Sheet
Sales Product Name BSZ900N15NS3 G
MA#
MA001326358
Package
PG-TSDSON-8-2
Construction Element Material Group
Substances
chip
leadframe
wire
encapsulation
leadfinish
plating
solder
heatspreader
heat sink CLIP
*deviation
inorganic material
inorganic material
non noble metal
non noble metal
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
noble metal
noble metal
non noble metal
non noble metal
inorganic material
non noble metal
non noble metal
non noble metal
inorganic material
non noble metal
non noble metal
non noble metal
< 10%
silicon
phosphorus
zinc
iron
copper
copper
carbon black
epoxy resin
silicondioxide
tin
silver
silver
tin
lead
phosphorus
zinc
iron
copper
phosphorus
zinc
iron
copper
Issued
30. January 2015
CAS#
if applicable
7440-21-3
7723-14-0
7440-66-6
7439-89-6
7440-50-8
7440-50-8
1333-86-4
-
60676-86-0
7440-31-5
7440-22-4
7440-22-4
7440-31-5
7439-92-1
7723-14-0
7440-66-6
7439-89-6
7440-50-8
7723-14-0
7440-66-6
7439-89-6
7440-50-8
Weight*
38.25 mg
Weight
[mg]
Average
Mass
[%]
Sum
[%]
Average
Mass
[ppm]
Sum
[ppm]
1.118
2.92
2.92 29239 29239
0.002
0.01
55
0.008
0.02
219
0.168
0.44
4383
6.808
17.80 18.27 177988 182645
0.027
0.07
0.07
699
699
0.035
0.09
917
1.807
4.72
47239
15.700 41.06 45.87 410473 458629
0.387
1.01
1.01 10122 10122
0.963
2.52
2.52 25167 25167
0.034
0.09
879
0.027
0.07
704
1.285
3.36
3.52 33596 35179
0.001
0.00
28
0.004
0.01
113
0.086
0.23
2254
3.501
9.15
9.39 91538 93933
0.002
0.00
49
0.008
0.02
197
0.151
0.39
3945
6.127
16.02 16.43 160196 164387
Sum in total: 100.00
1000000
Important Remarks:
1. Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
2. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
3. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
This product is in compliance with EU Directive 2011/65/EU (RoHS) and contains Pb according RoHS exemption
7a, Lead in high melting temperature type solders.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com