MA001321070 Datasheet, PDF (1/1 Pages) Infineon Technologies AG – Material Content Data Sheet

Material Content Data Sheet
Sales Product Name BSZ086P03NS3 G
MA#
MA001321070
Package
PG-TSDSON-8-2
Construction Element Material Group
Substances
chip
leadframe
wire
encapsulation
leadfinish
plating
solder
heatspreader
heat sink CLIP
*deviation
inorganic material
inorganic material
non noble metal
non noble metal
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
noble metal
non noble metal
noble metal
non noble metal
inorganic material
non noble metal
non noble metal
non noble metal
inorganic material
non noble metal
non noble metal
non noble metal
< 10%
silicon
phosphorus
zinc
iron
copper
copper
carbon black
epoxy resin
silicondioxide
tin
silver
tin
silver
lead
phosphorus
zinc
iron
copper
phosphorus
zinc
iron
copper
Issued
5. February 2015
CAS#
if applicable
7440-21-3
7723-14-0
7440-66-6
7439-89-6
7440-50-8
7440-50-8
1333-86-4
-
60676-86-0
7440-31-5
7440-22-4
7440-31-5
7440-22-4
7439-92-1
7723-14-0
7440-66-6
7439-89-6
7440-50-8
7723-14-0
7440-66-6
7439-89-6
7440-50-8
Weight*
38.76 mg
Weight
[mg]
Average
Mass
[%]
Sum
[%]
Average
Mass
[ppm]
Sum
[ppm]
1.835
4.73
4.73 47344 47344
0.002
0.01
54
0.008
0.02
216
0.168
0.43
4326
6.808
17.57 18.03 175653 180249
0.036
0.09
0.09
918
918
0.034
0.09
868
1.733
4.47
44727
15.062 38.87 43.43 388646 434241
0.387
1.00
1.00
9989
9989
0.963
2.48
2.48 24837 24837
0.037
0.10
950
0.046
0.12
1187
1.758
4.54
4.76 45350 47487
0.001
0.00
28
0.004
0.01
111
0.086
0.22
2225
3.501
9.03
9.26 90338 92702
0.002
0.00
49
0.008
0.02
195
0.151
0.39
3894
6.127
15.81 16.22 158095 162233
Sum in total: 100.00
1000000
Important Remarks:
1. Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
2. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
3. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
This product is in compliance with EU Directive 2011/65/EU (RoHS) and contains Pb according RoHS exemption
7a, Lead in high melting temperature type solders.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com