MA001233752 Datasheet, PDF (1/1 Pages) Infineon Technologies AG – Material Content Data Sheet

Material Content Data Sheet
Sales Product Name BSS138W H6327
MA#
MA001233752
Package
PG-SOT323-3-2
Construction Element Material Group
Substances
chip
leadframe
wire
encapsulation
leadfinish
plating
*deviation
non noble metal
noble metal
inorganic material
non noble metal
non noble metal
non noble metal
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
noble metal
< 10%
tin
gold
silicon
zinc
tin
chromium
copper
copper
carbon black
epoxy resin
silicondioxide
tin
silver
Issued
9. January 2015
CAS#
if applicable
7440-31-5
7440-57-5
7440-21-3
7440-66-6
7440-31-5
7440-47-3
7440-50-8
7440-50-8
1333-86-4
-
60676-86-0
7440-31-5
7440-22-4
Weight*
6.17 mg
Weight
[mg]
Average
Mass
[%]
Sum
[%]
Average
Mass
[ppm]
Sum
[ppm]
0.002
0.03
335
0.008
0.13
1299
0.091
1.47
1.63 14719 16353
0.005
0.09
863
0.007
0.11
1079
0.008
0.13
1295
2.644
42.83 43.16 428331 431568
0.005
0.09
0.09
870
870
0.031
0.49
4946
0.656
10.63
106331
2.366
38.33 49.45 383286 494563
0.133
2.15
2.15 21495 21495
0.217
3.52
3.52 35151 35151
Sum in total: 100.00
1000000
Important Remarks:
1. Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
2. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
3. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
This product is in compliance with EU Directive 2011/65/EU (RoHS) and does not use any exemption.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com