MA001134536 Datasheet, PDF (1/1 Pages) Infineon Technologies AG – Material Content Data Sheet

Material Content Data Sheet
Sales Product Name BGA 524N6 E6327
MA#
MA001134536
Package
PG-TSNP-6-2
Construction Element Material Group
Substances
chip
bumps
leadframe
encapsulation
leadfinish
plating
solder
*deviation
inorganic material
non noble metal
non noble metal
non noble metal
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
noble metal
noble metal
non noble metal
< 10%
silicon
copper
tin
zinc
chromium
copper
carbon black
epoxy resin
silicondioxide
tin
silver
silver
tin
Issued
29. August 2013
CAS#
if applicable
7440-21-3
7440-50-8
7440-31-5
7440-66-6
7440-47-3
7440-50-8
1333-86-4
-
60676-86-0
7440-31-5
7440-22-4
7440-22-4
7440-31-5
Weight*
0.92 mg
Weight
[mg]
Average
Mass
[%]
Sum
[%]
Average
Mass
[ppm]
Sum
[ppm]
0.093
10.16 10.16 101585 101585
0.003
0.33
0.33
3303
3303
0.001
0.10
971
0.001
0.08
777
0.001
0.12
1166
0.353
38.55 38.85 385643 388557
0.002
0.22
2240
0.060
6.50
64958
0.349
38.08 44.80 380790 447988
0.037
4.06
4.06 40550 40550
0.015
1.62
1.62 16200 16200
0.000
0.00
41
0.002
0.18
0.18
1776
1817
Sum in total: 100,00
1000000
Important Remarks:
1. Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
2. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
3. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com