MA001129930 Datasheet, PDF (1/1 Pages) Infineon Technologies AG – Material Content Data Sheet

Material Content Data Sheet
Sales Product Name BGA 748L16 E6327
MA#
MA001129930
Package
PG-TSLP-16-1
Construction Element Material Group
Substances
chip
leadframe
wire
encapsulation
leadfinish
plating
glue
*deviation
inorganic material
non noble metal
noble metal
organic material
plastics
inorganic material
noble metal
noble metal
plastics
noble metal
< 10%
silicon
nickel
gold
carbon black
epoxy resin
silicondioxide
gold
silver
epoxy resin
silver
Issued
29. August 2013
CAS#
if applicable
7440-21-3
7440-02-0
7440-57-5
1333-86-4
-
60676-86-0
7440-57-5
7440-22-4
-
7440-22-4
Weight*
7.31 mg
Weight
[mg]
Average
Mass
[%]
Sum
[%]
Average
Mass
[ppm]
Sum
[ppm]
0.271
3.71
3.71 37099 37099
2.483
33.98 33.98 339805 339805
0.099
1.36
1.36 13598 13598
0.040
0.55
5452
0.538
7.36
73596
3.406
46.61 54.52 466110 545158
0.131
1.79
1.79 17943 17943
0.214
2.93
2.93 29301 29301
0.025
0.34
3419
0.100
1.37
1.71 13677 17096
Sum in total: 100,00
1000000
Important Remarks:
1. Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
2. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
3. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com