MA001127054 Datasheet, PDF (1/1 Pages) Infineon Technologies AG – Material Content Data Sheet

Material Content Data Sheet
Sales Product Name BSL215C H6327
MA#
MA001127054
Package
PG-TSOP6-6-4
Construction Element Material Group
Substances
chip
leadframe
wire
encapsulation
leadfinish
plating
*deviation
non noble metal
noble metal
inorganic material
inorganic material
non noble metal
non noble metal
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
noble metal
< 10%
tin
gold
silicon
silicon
titanium
chromium
copper
copper
carbon black
epoxy resin
silicondioxide
tin
silver
Issued
19. December 2014
CAS#
if applicable
7440-31-5
7440-57-5
7440-21-3
7440-21-3
7440-32-6
7440-47-3
7440-50-8
7440-50-8
1333-86-4
-
60676-86-0
7440-31-5
7440-22-4
Weight*
14.81 mg
Weight
[mg]
Average
Mass
[%]
Sum
[%]
Average
Mass
[ppm]
Sum
[ppm]
0.006
0.04
438
0.025
0.17
1697
0.285
1.92
2.13 19231 21366
0.001
0.01
96
0.007
0.05
478
0.021
0.14
1434
7.048
47.61 47.81 476017 478025
0.078
0.53
0.53
5262
5262
0.068
0.46
4588
1.460
9.86
98642
5.264
35.56 45.88 355568 458798
0.392
2.65
2.65 26509 26509
0.149
1.00
1.00 10040 10040
Sum in total: 100.00
1000000
Important Remarks:
1. Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
2. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
3. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
This product is in compliance with EU Directive 2011/65/EU (RoHS) and does not use any exemption.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com