MA001126876_15 Datasheet, PDF (1/1 Pages) Infineon Technologies AG – Material Content Data Sheet

Material Content Data Sheet
Sales Product Name ESD108-B1-CSP0201 E6327
MA#
MA001126876
Package
SG-WLL-2-1
Construction Element Material Group
Substances
chip
pad
passivation
*deviation
inorganic material
inorganic material
noble metal
non noble metal
inorganic material
non noble metal
noble metal
non noble metal
inorganic material
inorganic material
< 10%
silicon
phosphorus
gold
copper
silicon
aluminium
palladium
nickel
SiO2
Si3N4
Issued
2. July 2015
CAS#
if applicable
7440-21-3
7723-14-0
7440-57-5
7440-50-8
7440-21-3
7429-90-5
7440-05-3
7440-02-0
60676-86-0
-
Weight*
0.07 mg
Weight
[mg]
Average
Mass
[%]
Sum
[%]
Average
Mass
[ppm]
Sum
[ppm]
0.063
94.60 94.60 945916 945916
0.000
0.09
857
0.000
0.09
902
0.000
0.00
30
0.000
0.00
15
0.000
0.34
3443
0.000
0.56
5623
0.003
4.13
5.21 41289 52159
0.000
0.07
692
0.000
0.12
0.19
1233
1925
Sum in total: 100.00
1000000
Important Remarks:
1. Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
2. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
3. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
This product is in compliance with EU Directive 2011/65/EU (RoHS) and does not use any exemption.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com