MA001108592 Datasheet, PDF (1/1 Pages) Infineon Technologies AG – Material Content Data Sheet

Material Content Data Sheet
Sales Product Name ESD300-B1-02LRH E6327
MA#
MA001108592
Package
PG-TSLP-2-21
Construction Element Material Group
Substances
chip
bumps
leadframe
encapsulation
leadfinish
plating
ubm
*deviation
inorganic material
noble metal
non noble metal
non noble metal
non noble metal
organic material
plastics
inorganic material
noble metal
noble metal
non noble metal
non noble metal
non noble metal
< 10%
silicon
silver
tin
copper
nickel
carbon black
epoxy resin
silicondioxide
gold
silver
titanium
tungsten
copper
Issued
29. August 2013
CAS#
if applicable
7440-21-3
7440-22-4
7440-31-5
7440-50-8
7440-02-0
1333-86-4
-
60676-86-0
7440-57-5
7440-22-4
7440-32-6
7440-33-7
7440-50-8
Weight*
0.62 mg
Weight
[mg]
Average
Mass
[%]
Sum
[%]
Average
Mass
[ppm]
Sum
[ppm]
0.136
21.83 21.83 218306 218306
0.000
0.01
92
0.002
0.39
3918
0.005
0.73
1.13
7290 11300
0.138
22.18 22.18 221761 221761
0.002
0.25
2532
0.046
7.34
73431
0.268
43.05 50.64 430455 506418
0.010
1.55
1.55 15487 15487
0.016
2.53
2.53 25290 25290
0.000
0.02
247
0.000
0.01
104
0.001
0.11
0.14
1087
1438
Sum in total: 100,00
1000000
Important Remarks:
1. Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
2. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
3. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com