MA001097554 Datasheet, PDF (1/1 Pages) Infineon Technologies AG – Material Content Data Sheet

Material Content Data Sheet
Sales Product Name BSS670S2L H6327
MA#
MA001097554
Package
PG-SOT23-3-5
Construction Element Material Group
Substances
chip
leadframe
wire
encapsulation
leadfinish
plating
*deviation
non noble metal
noble metal
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
noble metal
< 10%
tin
gold
silicon
chromium
silicon
titanium
copper
copper
carbon black
epoxy resin
silicondioxide
tin
silver
Issued
29. August 2013
CAS#
if applicable
7440-31-5
7440-57-5
7440-21-3
7440-47-3
7440-21-3
7440-32-6
7440-50-8
7440-50-8
1333-86-4
-
60676-86-0
7440-31-5
7440-22-4
Weight*
9.36 mg
Weight
[mg]
Average
Mass
[%]
Sum
[%]
Average
Mass
[ppm]
Sum
[ppm]
0.004
0.04
403
0.015
0.16
1564
0.223
2.39
2.59 23859 25826
0.009
0.10
966
0.001
0.01
64
0.003
0.03
322
3.000
32.06 32.20 320608 321960
0.009
0.10
0.10
960
960
0.057
0.60
6049
1.217
13.00
130048
4.387
46.87 60.47 468775 604872
0.150
1.60
1.60 15990 15990
0.284
3.04
3.04 30392 30392
Sum in total: 100,00
1000000
Important Remarks:
1. Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
2. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
3. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com