MA001091308 Datasheet, PDF (1/1 Pages) Infineon Technologies AG – Material Content Data Sheet

Material Content Data Sheet
Sales Product Name ESD200-B1-CSP0201 E6327
MA#
MA001091308
Package
SG-WLL-2-1
Construction Element Material Group
Substances
chip
pad
passivation
metallization
*deviation
inorganic material
inorganic material
noble metal
noble metal
non noble metal
inorganic material
inorganic material
non noble metal
inorganic material
non noble metal
< 10%
silicon
phosphorus
gold
palladium
nickel
SiO2
Si3N4
copper
silicon
aluminium
Issued
29. August 2013
CAS#
if applicable
7440-21-3
7723-14-0
7440-57-5
7440-05-3
7440-02-0
60676-86-0
-
7440-50-8
7440-21-3
7429-90-5
Weight*
0.07 mg
Weight
[mg]
Average
Mass
[%]
Sum
[%]
Average
Mass
[ppm]
Sum
[ppm]
0.063
94.55 94.55 945447 945447
0.000
0.09
857
0.000
0.09
902
0.000
0.56
5621
0.003
4.13
4.87 41268 48648
0.000
0.07
691
0.000
0.12
0.19
1232
1923
0.000
0.00
45
0.000
0.00
15
0.000
0.39
0.39
3922
3982
Sum in total: 100,00
1000000
Important Remarks:
1. Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
2. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
3. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com