MA001073296 Datasheet, PDF (1/1 Pages) Infineon Technologies AG – Material Content Data Sheet

Material Content Data Sheet
Sales Product Name BSP315P H6327
MA#
MA001073296
Package
PG-SOT223-4-21
Construction Element Material Group
Substances
chip
leadframe
wire
encapsulation
leadfinish
plating
*deviation
noble metal
non noble metal
inorganic material
inorganic material
non noble metal
non noble metal
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
noble metal
< 10%
gold
tin
silicon
silicon
titanium
chromium
copper
copper
carbon black
epoxy resin
silicondioxide
tin
silver
Issued
29. August 2013
CAS#
if applicable
7440-57-5
7440-31-5
7440-21-3
7440-21-3
7440-32-6
7440-47-3
7440-50-8
7440-50-8
1333-86-4
-
60676-86-0
7440-31-5
7440-22-4
Weight*
113.57 mg
Weight
[mg]
Average
Mass
[%]
Sum
[%]
Average
Mass
[ppm]
Sum
[ppm]
0.032
0.03
285
0.008
0.01
73
0.367
0.32
0.36
3227
3585
0.010
0.01
89
0.051
0.04
446
0.152
0.13
1339
50.489 44.46 44.64 444576 446450
0.104
0.09
0.09
912
912
0.604
0.53
5316
9.057
7.97
79747
50.717 44.67 53.17 446582 531645
1.464
1.29
1.29 12891 12891
0.513
0.45
0.45
4517
4517
Sum in total: 100,00
1000000
Important Remarks:
1. Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
2. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
3. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com