MA001068592 Datasheet, PDF (1/1 Pages) Infineon Technologies AG – Material Content Data Sheet

Material Content Data Sheet
Sales Product Name ICE3B1565J
MA#
MA001068592
Package
PG-DIP-8-9
Construction Element Material Group
Substances
chip
leadframe
wire
encapsulation
leadfinish
plating
glue
*deviation
inorganic material
inorganic material
non noble metal
non noble metal
non noble metal
noble metal
organic material
plastics
inorganic material
non noble metal
noble metal
plastics
noble metal
< 10%
silicon
phosphorus
zinc
iron
copper
gold
carbon black
epoxy resin
silicondioxide
tin
silver
epoxy resin
silver
Issued
29. August 2013
CAS#
if applicable
7440-21-3
7723-14-0
7440-66-6
7439-89-6
7440-50-8
7440-57-5
1333-86-4
-
60676-86-0
7440-31-5
7440-22-4
-
7440-22-4
Weight*
518.38 mg
Weight
[mg]
Average
Mass
[%]
Sum
[%]
Average
Mass
[ppm]
Sum
[ppm]
3.255
0.63
0.63
6280
6280
0.053
0.01
103
0.213
0.04
412
4.266
0.82
8231
173.237 33.42 34.29 334192 342938
0.422
0.08
0.08
814
814
1.308
0.25
2523
37.925
7.32
73161
287.705 55.50 63.07 555013 630697
7.496
1.45
1.45 14460 14460
0.801
0.15
0.15
1545
1545
0.254
0.05
490
1.439
0.28
0.33
2776
3266
Sum in total: 100,00
1000000
Important Remarks:
1. Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
2. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
3. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com