MA001062190 Datasheet, PDF (1/1 Pages) Infineon Technologies AG – Material Content Data Sheet

Material Content Data Sheet
Sales Product Name TDA21310
MA#
MA001062190
Package
LG-UIQFN-32-2
Construction Element Material Group
Substances
chip
dielectric layer
leadframe
leadfinish
glue
*deviation
inorganic material
inorganic material
inorganic material
plastics
inorganic material
non noble metal
non noble metal
inorganic material
non noble metal
inorganic material
noble metal
non noble metal
inorganic material
plastics
< 10%
silicon
aluminiumhydroxide
silicondioxide
epoxy resin
glass fibre
copper
iron
phosphorus
copper
phosphorus
gold
nickel
silicondioxide
maleimide resin
Issued
28. August 2013
CAS#
if applicable
7440-21-3
21645-51-2
60676-86-0
-
-
7440-50-8
7439-89-6
7723-14-0
7440-50-8
7723-14-0
7440-57-5
7440-02-0
60676-86-0
-
Weight*
83.10 mg
Weight
[mg]
Average
Mass
[%]
Sum
[%]
Average
Mass
[ppm]
Sum
[ppm]
1.421
1.71
1.71 17102 17102
1.923
2.31
23142
2.524
3.04
30374
3.366
4.05
40498
4.207
5.06
50623
25.603 30.81 45.27 308088 452725
0.043
0.05
517
0.013
0.02
155
42.885 51.61 51.68 516038 516710
0.017
0.02
209
0.065
0.08
777
0.968
1.16
1.26 11645 12631
0.035
0.04
416
0.035
0.04
0.08
416
832
Sum in total: 100,00
1000000
Important Remarks:
1. Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
2. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
3. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com