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MA001055080 Datasheet, PDF (1/1 Pages) Infineon Technologies AG – Material Content Data Sheet
Material Content Data Sheet
Sales Product Name IPB45N06S4-09
MA#
MA001055080
Package
PG-TO263-3-2
Construction Element Material Group
Substances
chip
leadframe
wire
encapsulation
leadfinish
plating
solder
heatspreader
*deviation
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
non noble metal
inorganic material
noble metal
non noble metal
non noble metal
non noble metal
inorganic material
non noble metal
< 10%
silicon
iron
phosphorus
copper
aluminium
carbon black
epoxy resin
silicondioxide
tin
nickel
phosphorus
silver
tin
lead
iron
phosphorus
copper
Issued
15. October 2014
CAS#
if applicable
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
60676-86-0
7440-31-5
7440-02-0
7723-14-0
7440-22-4
7440-31-5
7439-92-1
7439-89-6
7723-14-0
7440-50-8
Weight*
1557.56 mg
Weight
[mg]
Average
Mass
[%]
Sum
[%]
Average
Mass
[ppm]
Sum
[ppm]
2.120
0.14
0.14
1361
1361
0.304
0.02
195
0.091
0.01
59
304.026 19.52 19.55 195194 195448
3.012
0.19
0.19
1934
1934
10.313
0.66
6622
113.448 7.28
72837
563.805 36.21 44.15 361980 441439
9.657
0.62
0.62
6200
6200
0.228
0.01
147
0.001
0.00
0.01 361979 147
0.054
0.00
35
0.043
0.00
28
2.074
0.13
0.13
1332
1395
0.548
0.04
352
0.165
0.01
106
547.666 35.16 35.21 351618 352076
Sum in total: 100.00
1000000
Important Remarks:
1. Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
2. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
3. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
This product is in compliance with EU Directive 2011/65/EU (RoHS) and contains Pb according RoHS exemption
7a, Lead in high melting temperature type solders.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com