MA001052370_15 Datasheet, PDF (1/1 Pages) Infineon Technologies AG – Material Content Data Sheet

Material Content Data Sheet
Sales Product Name BGS 22WL10 E6327
MA#
MA001052370
Package
PG-TSLP-10-1
Construction Element Material Group
Substances
chip
bumps
leadframe
encapsulation
leadfinish
plating
ubm
solder
*deviation
inorganic material
non noble metal
non noble metal
organic material
plastics
inorganic material
noble metal
noble metal
non noble metal
non noble metal
non noble metal
noble metal
non noble metal
< 10%
silicon
copper
nickel
carbon black
epoxy resin
silicondioxide
gold
silver
titanium
tungsten
copper
silver
tin
Issued
30. April 2015
CAS#
if applicable
7440-21-3
7440-50-8
7440-02-0
1333-86-4
-
60676-86-0
7440-57-5
7440-22-4
7440-32-6
7440-33-7
7440-50-8
7440-22-4
7440-31-5
Weight*
1.46 mg
Weight
[mg]
Average
Mass
[%]
Sum
[%]
Average
Mass
[ppm]
Sum
[ppm]
0.563
38.67 38.67 386730 386730
0.011
0.78
0.78
7799
7799
0.141
9.70
9.70 96981 96981
0.003
0.24
2382
0.101
6.91
69062
0.589
40.47 47.62 404845 476289
0.015
1.00
1.00
9978
9978
0.024
1.63
1.63 16294 16294
0.001
0.04
377
0.000
0.02
197
0.002
0.11
0.17
1065
1639
0.000
0.01
99
0.006
0.42
0.43
4191
4290
Sum in total: 100.00
1000000
Important Remarks:
1. Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
2. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
3. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
This product is in compliance with EU Directive 2011/65/EU (RoHS) and does not use any exemption.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com