MA001021474_15 Datasheet, PDF (1/1 Pages) Infineon Technologies AG – Material Content Data Sheet

Material Content Data Sheet
Sales Product Name BSC018NE2LSI
MA#
MA001021474
Package
PG-TDSON-8-6
Construction Element Material Group
Substances
chip
leadframe
wire
encapsulation
leadfinish
plating
solder
heatspreader
heat sink CLIP
*deviation
inorganic material
non noble metal
inorganic material
non noble metal
noble metal
organic material
plastics
inorganic material
non noble metal
noble metal
noble metal
non noble metal
non noble metal
non noble metal
inorganic material
non noble metal
non noble metal
inorganic material
non noble metal
< 10%
silicon
iron
phosphorus
copper
gold
carbon black
epoxy resin
silicondioxide
tin
silver
silver
tin
lead
iron
phosphorus
copper
iron
phosphorus
copper
Issued
17. June 2015
CAS#
if applicable
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7440-57-5
1333-86-4
-
60676-86-0
7440-31-5
7440-22-4
7440-22-4
7440-31-5
7439-92-1
7439-89-6
7723-14-0
7440-50-8
7439-89-6
7723-14-0
7440-50-8
Weight*
118.48 mg
Weight
[mg]
Average
Mass
[%]
Sum
[%]
Average
Mass
[ppm]
Sum
[ppm]
0.629
0.53
0.53
5310
5310
0.038
0.03
319
0.011
0.01
96
37.762 31.87 31.91 318720 319135
0.045
0.04
0.04
380
380
0.088
0.07
739
6.215
5.25
52455
37.464 31.62 36.94 316209 369403
1.470
1.24
1.24 12406 12406
0.166
0.14
0.14
1397
1397
0.023
0.02
198
0.019
0.02
158
0.895
0.76
0.80
7550
7906
0.011
0.01
96
0.003
0.00
29
11.320
9.55
9.56 95545 95670
0.022
0.02
188
0.007
0.01
57
22.292 18.81 18.84 188148 188393
Sum in total: 100.00
1000000
Important Remarks:
1. Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
2. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
3. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
This product is in compliance with EU Directive 2011/65/EU (RoHS) and contains Pb according RoHS exemption
7a, Lead in high melting temperature type solders.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com